May 29: India’s semiconductor manufacturing push gained further momentum on Friday after the Government of Odisha signed a Memorandum of Understanding (MoU) with Intel and 3D Glass Solutions (3DGS) to introduce advanced substrate manufacturing technology in the state.
Union Electronics and IT Minister Ashwini Vaishnaw announced the development, highlighting that the partnership will strengthen India’s semiconductor ecosystem and support the country’s broader goal of building a complete and self-reliant electronics supply chain. He noted that substrate manufacturing plays a critical role in semiconductor production, as it enables the connection and support structure for chips used across electronic devices.
According to officials, the collaboration is expected to enhance India’s capabilities in advanced chip packaging and related technologies, which are becoming increasingly important in areas such as artificial intelligence, high-performance computing, and next-generation consumer electronics.
The agreement also aligns with the Centre’s ongoing semiconductor roadmap under the India Semiconductor Mission (ISM). The government recently approved two semiconductor-related projects, including India’s first commercial Mini/Micro-LED display facility based on Gallium Nitride (GaN) technology and a semiconductor packaging unit in Gujarat. Together, these projects involve investments of approximately ₹3,936 crore and are expected to generate employment for around 2,230 skilled professionals.
Officials further noted that India’s semiconductor strategy is progressing steadily, with multiple fabrication and manufacturing facilities in the pipeline. Earlier projections indicate that four semiconductor plants are expected to be operational by 2026, with two additional plants planned for 2027. The country’s first fabrication unit in Dholera is also projected to become operational by 2028.
Industry experts view the Odisha–Intel–3DGS partnership as a significant step toward strengthening India’s position in the global semiconductor value chain, particularly in high-value segments such as substrate manufacturing and advanced packaging.
With this development, India continues to accelerate efforts to build domestic capabilities in semiconductor design and manufacturing, while attracting global technology partnerships to support long-term industrial growth.
